Application: Set Geometry for Physical Vapor Deposition (PVD)
Properly setting up the geometric relationships among various components is crucial to building a successful PVD production process.
Tin Model programs accept geometric arrangements of virtually all PVD processes known to exist. And they allow you to experiment with novel geometries that are yet to be discovered.
Substrate carriers can move in single rotation or planetary rotation with two independent axes. Substrate carriers can also move in a linear fashion.
More advanced techniques, such as triple rotation of substrates or power modulation in transit, can be modeled with the help of the Composite-Process Handler, a capability of newer Tin Model programs.
Drum coating and roll-to-roll coating can be conveniently modeled.
A vapor source, be it an e-beam evaporator, a planar magnetron, a cylindrical magnetron, an ion-beam sputtering target, or a one-of-kind physical device, can be positioned and tilted relative to the substrate carriers.
Multiple vapor sources can be included.
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